On-going Development of packaging substrate material with dual-characteristics of high insulation/heat dissipation and high strength/machinability inorganic-organic fiber reinforced composite
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작성자 최고관리자 작성일 25-12-18 11:09본문
- Progress
- On-going
- 이전글Multiscale Design and Fabrication of vitrimer/BN-based recyclable multifunctional nanocomposites 25.12.18
- 다음글Reactive multiscale aging prediction technology of epoxy composties for electrical insulation and protective coating of nuclear power plant facilities 25.12.18
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